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新型多靶磁控濺鍍系統 New Advanced Multi-Gun Magnetron Sputtering System
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本新型多靶磁控濺鍍機係由高真空主腔體、冷凍幫浦、load-lock腔體所組成，主腔體在待機時背景真空度可維持在3x10-7 torr以下，此外，配備三個磁控濺鍍槍(兩個DC gun及一個RF gun)進行濺鍍。在本系統的設計中，可製備單層、雙層或多層金屬或合金薄膜，以及多靶共濺鍍合金薄膜。本系統亦配備旋轉試片座的機構以維持厚度的均勻性，並輔以冷卻系統快速冷卻試片，方便製備非晶質合金薄膜。此外，本系統配備load-lock腔體，加速試片的抽換，也保護主腔體讓其維持在良好的真空度，以提供一個品質優良、方便、高效率的實驗環境。 |
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The newly designed multi-target magnetron sputtering system provides three 3” magnetron gun (including 2 DC guns & 1 RF gun). In this system, the base pressure remains below 3×10-7 torr using cryo-pump. In addition, the metallic, alloy thin film and metal-metal multilayer thin film can be fabricated easily in this system. Also, the rotation device with cooling system can provide a good homogeneity of thickness and good formability for amorphous thin films. The specimens can be exchanged to the main chamber efficiently with the load-lock chamber. It’s indeed a good quality, convenient and high efficiency sputtering system.
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